MEMS Device Assembly

Mikroelektromekaniske systemer krever spesialisert SMT. Lodding med lav stress (<1GPa) protects delicate structures. Cleanroom requirements: ISO Class 5 environment. Hermetic sealing with glass frit bonding. RF shielding using cavity packages. Testing: Resonance frequency analysis ±0.1%. Applications: Gyroscopes, pressure sensors. Yield optimization through vibration-isolated placement.