SMT termisk profilering

Reflow Profiling krever 4- Faseoptimalisering: forvarming (1-3 grad /s), soak (60-120 s på 150-180 grad), refow (30-60 s over 217 grader), avkjøling (<6°C/s). KIC thermal profilers use predictive algorithms for complex boards. Thermocouples attach to thermal mass areas for accuracy. Nitrogen environments permit 10°C lower peak temperatures. Ramp-to-spike profiles reduce tombstoning. DOE methods correlate profile settings with shear strength. Standards: IPC-7531 guidelines for profile validation.